Advanced Packaging
Advanced Packaging enables next-generation semiconductor assemblies with higher precision and integration. Infotech offers flexible automation for die bonding, flip-chip bonding, dispensing, inspection and testing – from lead frame and substrate to wafer and panel-level processes.
Die Bonding & Flip-Chip Bonding
High-accuracy die bonding, flip-chip bonding and advanced joining processes for automated die-to-package assembly. Integrate placement, fluxing, dispensing and bonding in one configurable platform – from lead frame and substrate to wafer and panel-level processes.
Key Features:
- Fluxing, dispensing and bonding on one platform
- Advanced joining, including inert gas environments
- C2S, C2W and CoP assembly formats
Inline Inspection (AI) & Testing
Integrate AI vision inspection, testing and analytics directly into the process flow. Inline quality control supports robust processes and stable, repeatable production quality.
Dispensing & Underfill
Configure 2D and 3D dispensing processes for flux, underfill and UV-curing applications. Multiple valve technologies support application-specific volumes, patterns and material viscosities from development through production.