Assembly Technology
The precise assembly of a wide variety of components is a key element of many manufacturing processes. Infotech offers highly flexible, repeatable and adaptable automated solutions for specific applications.
Die Bonding
Infotech offers flexible die bonding solutions that go beyond the traditional separation and placement of chips. Thanks to its modular system architecture, Infotech can efficiently integrate additional process steps, such as dispensing, handling, and assembly, into the bonding process.
Key Features:
- Combination of die bonding with additional functions, such as dispensing, joining, and mounting.
- Compatibility with wafer sizes ranging from 4" to 12" in various frame formats.
- Integration of all modules via Infotech's VisualMachines™ software.
- Flexible adaptation to SEMI standards or customer-specific processes.
- Suitable for LED products, sensors, MEMS, VCSELs, and power semiconductors.
The Infotech Component Matrix enables the creation of custom die bonding systems tailored to specific requirements, whether for development or series production. Thanks to end-to-end software control, complex applications, such as chip-on-chip or chip-on-wafer, can be implemented precisely. The platforms support die sizes as small as 200 µm directly from the wafer, enabling maximum repeatability and flexibility, even when processing sensitive materials or handling multiple process steps in parallel on a single line.
Flip Chip Bonding
Learn how flip chips are assembled, turned, and contacted with maximum precision using flippers, dosing systems, and hot gas soldering on the Flip Chip Bonding details page.
Ultrasonic Bonding
Ultrasonic bonding, also known as thermosonic bonding, is a precise process used to join flip chips or bumped components. This process creates mechanically stable connections by using vibration, pressure and heat.
Key Features:
- Direct connection of bumped components to substrates using ultrasound.
- Combination of substrate preheating, vibration, and defined contact pressure.
- Local welding through friction and heat without additional solder.
- Real-time control and synchronization of all process parameters.
- High process reliability thanks to a stable machine platform and controlled force profiles.
In ultrasonic bonding, a flip chip or bumped component is pressed onto a preheated substrate at a controlled force using a vibrating placement nozzle. The friction between the bumps and pads generates local heat, ensuring a permanent and reliable mechanical connection without additional material. The precise interaction of bonding force, ultrasonic power, substrate temperature, and process duration is crucial for the quality of the bonding process. Infotech systems enable the precise control and synchronization of these parameters, resulting in a highly stable and reproducible process. Ultrasonic bonding can also be seamlessly integrated with other processes on the same platform.
Eutectic Bonding
Eutectic bonding is a precise, flux-free joining process that uses special alloys. It is ideal for connecting sensitive electronic components and ensures permanently high mechanical and thermal stability.
Key Features:
- Use of eutectic alloys, such as Au-Sn, Au-Si, and Al-Ge.
- Flux-free melting of metallization under controlled temperature and force.
- Permanent bonding of the chip and substrate without residues.
- High positional accuracy and plane parallelism are required.
- This process is particularly suitable for VCSEL diodes, MEMS, and chip-on-wafer applications.
The eutectic bonding process utelizes the defined melting temperatures of the alloys that have already been deposited on the chip and substrate. During bonding, these layers fuse together without the use of flux under precisely controlled levels of force and temperature. The resulting bond is both mechanically stable and highly thermally conductive, making it ideal for use in optoelectronic and performance-critical components. Typical applications include the precise assembly of VCSEL diodes on sub mounts, ensuring the micrometer-precise protrusion of the emitting edge and the plane parallelism between the diode and substrate. This process is also used in MEMS packaging and chip-on-wafer technologies, where maximum accuracy and purity are required.
Watch Parts
Infotech offers automated solutions for the precise assembly of watch movements, dials and components. These range from standardized sub-processes to the fully automated assembly of mechanical watches.
Key Features:
- A fully automatic assembly mechanism for complete watch movements.
- Use of the modular Infotech Component Matrix.
- Integrated image processing for precise positioning and joining.
- Standardized handling and feed systems ensure maximum process reliability.
- It is also suitable for individual processes, such as glass or dial assembly.
Although the watch industry traditionally uses semi-automatic machines or special systems, Infotech is the first company worldwide to achieve the fully automated assembly of a mechanical watch movement. To make this possible, Infotech collaborated with a renowned Swiss manufacturer. This achievement is based on the Infotech Component Matrix, which consists of proven standard axes, handling systems, and feed solutions. Precise image processing plays a central role in maintaining even the smallest tolerances, particularly in complex assemblies such as gears, anchors, and balance wheels.
However, it's not only complex, but complete solutions that can be automated. Infotech systems can also automate and reproduce precise processes such as bonding watch glasses and assembling dials.