KEY FEATURES
- Direct contact of chips with BGAs or µBGAs on substrates.
- An integrated flipping unit reorients the component.
- Solder bumps are aligned precisely on bond pads using image processing.
- Flux application by dosing or dipping
- Optional hot gas soldering system for prototypes, repairs, and small series.
In flip chip bonding, chips with solder bumps on the underside are placed upside down on the substrate. This process is commonly used for components with numerous connection points, such as BGA or µBGA housings. Alignment must be carried out with the utmost precision to ensure that each solder ball is placed precisely on its bond pad.
Infotech offers turning units and dispensing solutions that can position and prepare the chip for this process with great precision. For low-throughput applications or development purposes, a reliable hot gas soldering system is used to deliver consistent results, even for individual pieces or rework. Flip chip processes can easily be combined with other Infotech technologies.