Packaging Technology
Infotech offers flexible solutions for the automated packaging of a wide variety of components, ranging from single-part removal to loaded carrier packaging. We focus on precision, product protection, and process integration.
Packing in Waffle Packs
Infotech offers automated solutions for packaging small components, such as sensors, semiconductor chips and watch parts, in 2" or 4" waffle packs.
Key Features:
- Standardized waffle and gel pack packaging.
- Sorting according to quality classes, e.g., directly from the wafer.
- Suitable for small parts from the electronics and watch industries.
- Gentle and precise handling.
- Flexible integration into existing processes.
If components are not delivered in packaging, Infotech can automate this step reliably. The system separates the components, checks their quality and sorts them into waffle packs or alternative carriers. It can be adapted to handle various formats and requirements, from wafers to finished trays.
Packing in JEDEC Trays
In addition to waffle packs, Infotech offers automated solutions for sorting and packaging components in standardized JEDEC trays. These solutions are ideal for high volumes and long autonomy times.
Key Features:
- Packaging is in JEDEC trays in the standard format.
- Feeding is possible via bulk material or directly from wafers.
- Stack feeding system for several hours of operation.
- The process is fully automated and stable.
- Ideal for electronic components and microchips.
JEDEC trays are ideal for applications with high throughput and standardized processes. Infotech systems pick up unsorted components from bulk containers or directly from wafers, separate them, and place them in the correct order in JEDEC trays. Thanks to the integrated stacking feed, multiple trays can be changed automatically, enabling unattended operation over longer periods. This robust, precise, and scalable solution is ideal for a wide variety of component types.
Packing in Blister Trays
Blister belts are a well-established packaging format in the microelectronics industry. Infotech's technology enables the fully automated filling of blister belts, even in industries where this technology is still new, such as the watch industry.
Key Features:
- Fully automatic packaging solution for blister tapes.
- Feeds bulk material via a sorting and image processing system.
- Optical inspection is performed before packaging.
- Optional greasing of mechanical components before sealing.
- The heat-sealing system ensures secure packaging closure.
Blister Tapes are the preferred packaging format for many automated processes, particularly in the microelectronics industry, where they have been used for decades. Infotech offers a compact, fully automatic packaging system that separates components from bulk goods, inspects them and, if necessary, pre-treats them by greasing them, for example.
The system then precisely sorts the components into the belt segments. Sealing is then carried out via an integrated heat sealing station.
This solution is ideal for industries where blister packaging is not commonly used, and it can be adapted to suit different component shapes and cycle times.