Preforms Assembling
In Power Module Production, flux-free solder joints are essential for ensuring component reliability. Infotech relies on an automated assembly process involving solder preforms that are cut to size and positioned precisely within the system.
Key Features:
- Flux-free soldering using solder preforms instead of solder paste.
- Roll-based feed and precise cutting directly in the machine.
- Precise positioning is possible thanks to suction cups that allow for flat, parallel pickup.
- A combination of loading, dosing, and placement on a single system.
- Externally interchangeable feed units allow for easy handling.
Lot preforms ensure reliable, flux-free solder joints in power electronics, which is essential for meeting high-quality standards. Infotech offers an automated system that feeds the preforms from a roll, cuts them to the required length and positions them accurately on the substrate.
Special suction cups ensure a secure hold and accurate positioning. Thanks to its modular design, the system can also carry out additional processes, such as dispensing bonding agents and placing power semiconductors, on the same platform. The external setup of the preform feed unit ensures high system availability, as it can be carried out without entering the machine room.
Die Bonding
The precise placement of power semiconductors, such as insulated-gate bipolar transistors (IGBTs) and diodes, on substrates is a critical step in the manufacturing of power modules. Infotech enables direct handling from the wafer, eliminating the need for intermediate steps or manual transfer.
Key Features:
- Place chips directly from the wafer into large-format oven carriers.
- No need to transfer substrates to separate workpiece carriers.
- Thin chips are gently cut using needle bed technology.
- Automatic rotation correction, even with inaccurately clamped wafers.
- It is possible to combine preform placement and dispensing on one system.
Power semiconductors usually have a large edge length and a very low thickness, so they require special care when being handled. Infotech uses a specially developed needle bed to pick up the chips directly from the wafer without causing any damage.
Even when wafers are clamped inaccurately, the rotation position adjusts automatically to ensure precise, damage-free removal. Thanks to its integration with large-format oven carriers, there is no need for transfer to smaller carrier formats.
Depending on the required cycle time, additional processes such as dispensing bonding agents or preform loading can be carried out on the same platform to maximize process density in minimal space.
Gel Dispensing: Coating High-Voltage Modules with Insulating Layers
Reliable operation of high-voltage modules requires precise insulation coating. Infotech offers an automated solution that applies polyimide and other protective coatings with precision.
Key Features:
- Precise coating of semiconductor surfaces, bond wires and edge areas.
- Integrated image processing enables precise recognition of structures and web guidance.
- Contactless application are enabled by jetting-based dosing technology.
- There are automated cleaning, rinsing and calibration modules.
- Seamless process and quality monitoring.
When manufacturing high-voltage modules, it is essential to protect sensitive components, such as bond wires and semiconductor surfaces, by applying a uniform insulating layer. This is usually done by applying polyimide.
At Infotech, a jetting system with integrated image processing is used to apply the polyimide in a contactless manner, precisely orienting itself to existing structures. The system automatically recognizes the areas to be coated and guides the nozzle along defined paths with precision. This process is supplemented by modules for automatic cleaning, calibration and monitoring, which can be configured flexibly from the Infotech Component Matrix. The result is a reproducible, quality-controlled coating that meets the rigorous standards of power electronics.
Pressing Pins into Power Electronics Modules
At the end of the production process, power modules must be securely connected to external connections. Infotech offers a precise, documented, and traceable automated press-fit process for contact pins.
Key Features:
- Pins are automatically pressed into the prepared sleeves.
- Pick up and align the pins directly from bulk material.
- Monitor the process using a force-displacement diagram.
- There is traceability through connection to data systems.
- Achieve a reliable mechanical connection without soldering.
Contact pins are often pressed into place to connect a power electronics module to the housing and its connections. Infotech fully automates this process.
First, the pins are separated from the bulk material. Then, they are aligned vertically and pressed into the module's sleeves. During the process, a force-displacement diagram is recorded and stored digitally in real time. This process data can be transferred to a central system for quality assurance or traceability purposes. Press-fitting replaces conventional soldered connections, guaranteeing a robust and reliable mechanical connection.