Testing
Infotech integrates modular testing solutions directly into the manufacturing process to test the electrical, optical and mechanical properties of a wide variety of components. This allows for efficient and reliable quality and functionality checks.
Chip Testing
Not all testing tasks can be handled with standard solutions. Infotech offers flexible automation solutions for customized testing processes in the electronics manufacturing industry.
Key Features:
- Integration of individual test units or test Production Cells.
- Reliable feeding, positioning, and sorting of components.
- Precise image processing for position detection and optical inspection.
- Compatible with a wide range of component sizes and formats.
- Expandable with the Infotech Component Matrix.
In many cases, the customer or a specialist supplier will provide the actual test system. Infotech is responsible for the surrounding automation, including feeding untested components and precisely placing and sorting tested parts into the correct output format. Combining this with image processing systems enables the exact position to be detected and an additional visual check to be performed. The modular architecture allows for quick adaptation to new test requirements.
Inspecting Small Parts
Infotech's compact, automated solution is ideal for quality control in sensitive production processes, as it can precisely inspect and sort small parts.
Key Features:
- Integration of optical, electrical, and data-based testing systems.
- Supports wafer map-based die sorting by bin classes.
- Compatible with tests such as partial discharge and known Good Device Testing.
- Offers flexible handling and sorting into different packaging formats.
- It has compact system architecture with third-party testing technology.
In modern Production Lines, testing and sorting small parts is an important aspect of quality assurance. Infotech integrates external testing units, such as those used for electrical or optical testing, directly into automated sorting systems.
Infotech ensures precise handling and allocation, particularly in die sorting, where chips are sorted according to the wafer map or fault classes. Demanding inspection procedures, such as partial discharge testing for power semiconductors, can also be seamlessly incorporated into the production process.
Our strength lies in the flexible automation of the entire process, from feeding to the sorted storage of inspected parts.