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Die Bonding Solutions

LIMITLESS VERSATILITY

Infotech offers precise bonding equipment for the automated assembly of semiconductors onto substrates and power modules. These platforms are ideal for development environments and fully automated production lines.

Products
Applications Die Bonding
A close-up view of a dispensing head dispensing white liquid

High-performance bonding solutions for development and series production

The Hybrid Bonder combines bonding and sintering processes on a single platform, making it ideal for flexible development environments. The Die Bonder provides maximum precision and speed for fully automated use in large-scale production.
Both systems are based on the modular Infotech platform and can be configured according to your needs.

Customer Specific Automation Solutions

The Infotech Component Matrix provides pre-developed components that enable flexible and rapid adaptation to customer requirements.

Swiss Precision

Our systems are developed and manufactured entirely in Switzerland using 95% Swiss components to ensure the highest quality through local production.

Multiple processes, one machine

This compact system automates processes such as dosing, loading, sorting, testing, feeding, and handling.

Scalable Automation Solutions

Processes can be developed and tested on a Desktop System in a laboratory and then seamlessly transferred to Production Cells or Production Lines.

Interested?

Contact us now to schedule a personalized consultation. Together, we will take your automation processes to the next level!

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