Die Bonder

The Infotech Die Bonder is designed for continuous industrial operation and is ideal for the automated placement of dies on DBC substrates or other carrier materials. Thanks to its robust construction and precise motion axes, it can achieve the high levels of repeatability and short cycle times required for modern series production in power electronics.

• Universally configurable.
• The Infotech Die Bonder offers professional solutions for demanding processes involving difficult components and materials, as well as a wide variety of assembly and connection technologies.
• Semiconductor chips, such as ASICs, IGBTs, laser diodes, photonic components, sensors, detectors, MEMS, and image sensors, are ejected directly from the wafer. Then they are picked up, aligned, and assembled.
• Bonding techniques include classic die bonding with epoxy or conductive adhesives, flip chip bonding, eutectic bonding, thermocompression bonding, ultrasonic bonding, and sinter bonding.
• Chips can be mounted on ceramic substrates, printed circuit boards, submounts, foils, other carriers, or directly on wafers (chip-on-wafer), other chips (chip-on-chip), or other housing types.
• To ensure precise adherence to the bond line thickness, the chip can be mounted at a defined height above the substrate or with a specific bond force.

Based on the proven Infotech platform, the system can be equipped with various bond heads, feed units, image processing systems, and force measurement modules. Whether you need simple die placement or complex assembly processes involving multiple components, the Infotech Die Bonder can be precisely tailored to your production requirements, offering maximum efficiency and traceability.