Hybrid Bonder
The Infotech Hybrid Bonder is a compact system that combines bonding and SMD assembly, making it ideal for development environments, feasibility studies, and process optimization. Thanks to its modular platform, it can be adapted to specific requirements. Like all Infotech machines, the Hybrid Bonder can combine assembly tasks with dispensing processes and other functions.
Hybrid Bonder: A flexible bonding system for development, prototyping, and process validation
The Infotech Hybrid Bonder is tailored specifically to the needs of laboratories, prototyping, and process development. This system allows for the precise placement of dies on substrates (die bonding) and subsequent pre-sintering on a single platform. This allows for the development and testing of product-specific process parameters under real conditions before transferring them to automated series production.
Modular design with application-specific equipment
According to the Infotech Component Matrix, the Infotech Hybrid Bonder can be equipped with one or more heated bonding heads for force-intensive processes, a heated substrate holding plate with adjustable tilt, and a high-precision XY system. Various dosing and feed units are available as optional extras. These features allow for customization to specific application scenarios, making it ideal for complex or novel bonding and sintering processes in technical centers or R&D environments.
