IB‑Wafer Feeder

PARALLEL AUTOMATED FEEDING FOR HIGHER UPH POTENTIAL

The Infotech IB‑Wafer Feeder provides reliable automated handling and continuous die supply for bonding processes. Parallel material feeding decouples feeding from the main process, supporting UPH potential while the next part is prepared. The adjustable transport system extends the travel range to a depth of up to 610 mm.

Advanced Packaging

Flyer Advanced Packaging

Parallel instead of sequential - with an expandable transport range

The IB Wafer Feeder combines stable loading and unloading with precise positioning for repeatable throughput. Parallel material feeding and production support higher UPH potential, while the extendable conveyor accommodates large panels and an expanded travel range of up to 610 mm in depth.

Key Features

Parallel automated feeding for UPH potential
Continuous die feeding for bonding processes
Stable loading and unloading, as well as precise positioning
Extended travel range up to 610 mm in depth
Compact add-on for flexible process automation
Large die processing

Prepare the next chip while the main process is running

The IB-Wafer Feeder decouples the material feed from the main process. Parallel feeding reduces sequential dependencies and supports the efficient use of the production platform.

Products Power Module Production