Power Module Die Bonder

Unlike traditional die bonding, manufacturing power modules places special demands on precision and efficiency. Power semiconductors, such as power MOSFETs, IGBTs, and diodes, are cut directly from wafers and positioned on direct bonded copper (DBC) substrates in large workpiece carriers. The Infotech Power Module Die Bonder provides ample space for this process, allowing substrates to be loaded directly into vacuum furnace carriers without the need for reloading.

The system enables the automatic feeding, cutting, and placement of solder preforms directly from the roll. Depending on the process requirements, bonding agents can be applied in measured doses. Alternatively, graphite templates or weights can be placed on the assembled chips to fix them in position, providing maximum process control and flexibility.