Sinter Bonder

Sinter bonding system for chip connections

The Sinter Bonder uses pressure-assisted sintering to produce reliable chip connections in power electronics. This system combines precise positioning with stable processes to meet the highest quality standards.

Applications Power Module

Flyer Sinter Bonder (EN)

The Infotech Sinter Bonder is used to create reliable chip connections in power electronics

The Infotech Sinter Bonder meets the highest standards for mounting chips in power electronics, whether in a laboratory setting with batch processing or on a fully automated production line. Compared to conventional die bonders, it provides significantly greater flexibility and reliability in demanding sintering applications.

Its modular design allows for maximum precision and adaptability

Thanks to its configuration with modules from the Infotech Component Matrix, the Sinter Bonder is specially designed for power-intensive sintering processes. The system can be customized to suit the application with options such as heated bonding heads, substrate preheating, integrated force measurement, and DTF feeders. Larger dies are first pre-sintered and then finalized in a sintering press, while smaller components, such as LEDs, can be sintered directly on the substrate.